Deck 5: Supporting Processors and Upgrading Memory

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Question
Today's DIMMs use a 64-bit data path.
Use Space or
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Question
Which of the following is NOT a feature of a processor?

A) clock speed
B) processor architecture
C) amount of CMOS
D) multi-core processing
Question
After installing the processor, if the system begins the boot process and suddenly turns off before completing the boot, the processor is most likely overheating.
Question
When installing a processor, you must line up the red circle on the processor with the right-angle mark on the motherboard.
Question
Which of the following is true about DIMM technologies?

A) DDR2 uses 184 pins
B) DDR3 is backward compatible with DDR2
C) SDRAM runs synchronized with the system clock
D) the S in SDRAM stands for static
Question
Which of the following is true about installing a processor on a motherboard?

A) after placing the processor in the socket, you need to lock down the lever
B) it's okay to reuse thermal compound when you remove and reinstall a processor
C) processors are protected from ESD, so you don't need a grounding bracelet
D) use plenty of thermal compound, you can never use too much of this substance
Question
Which type of memory is the main memory installed as DIMMs on a motherboard?

A) SRAM
B) CMOS RAM
C) DRAM
D) Flash RAM
Question
Multiple processors can be installed in a single processor housing.
Question
Which of the following is NOT a component of a processor?

A) device driver
B) control unit
C) registers
D) memory caches
Question
The two major manufacturers of processors are Intel and NVIDIA.
Question
What is the most likely result of a correctly installed processor, but an incorrectly installed cooler?

A) powers on, but nothing else happens
B) boot process begins, but system suddenly turns off after a short period
C) system does not power on at all
D) BIOS setup does not recognize the processor correctly
Question
What unit of measurement is used for DIMM read and write times?

A) milliseconds
B) microseconds
C) nanoseconds
D) picoseconds
Question
DIMMs used in servers can provide additional reliability if they use which of the following technologies?

A) EDO
B) dual ranked
C) ECC
D) PC3
Question
Which of the following is true about DIMM slots?

A) color coding is used to identify the channel
B) DDR2 and DDR3 support triple channels
C) DDR only supports a single channel
D) a DDR3 DIMM allows access to four memory chips simultaneously on each DIMM
Question
Which type of memory can support quad, triple, and dual channels?

A) DDR3
B) DDR2
C) DDR
D) RIMM
Question
Which type of processor memory is located on the processor chip (processor die)?

A) Level 0 cache
B) Level 1 cache
C) Level 2 cache
D) Level 3 cache
Question
Which Intel processor technology interconnects the processor, chipset, and wireless network adapter as a unit, improving laptop performance?

A) Pentium
B) Core i5
C) Celeron
D) Centrino
Question
What is the transfer rate of a 64-bit module running at 1600 MHz?

A) 1600 MB\second
B) 3200 MB\second
C) 6400 MB\second
D) 12800 MB\second
Question
Which of the following statements is NOT true when setting up dual channeling?

A) a pair in a channel must be equally matched in size, speed and features
B) if two DIMM slots do not have matching pairs, single-channeling will be used
C) each channel runs independently of the other channel
D) if you have two pairs installed in two channels, all four DIMMs must match
Question
What is the general name of the processor feature that AMD calls HyperTransport?

A) multi-core processing
B) multithreading
C) virtualization support
D) integrated graphics
Question
List the four major categories of memory modules and mention how they are used today.
Question
The __________________ family of AMD processors has processors that run up to 3.2 GHz, have up to 6 cores, and use the AM3 socket.
Question
Which memory technology that is no longer used has a 32-bit data bus, 232 pins and requires a placeholder in empty slots?

A) CAS RAM
B) SO-DIMM
C) RIMM
D) SIMM
Question
CAS _____________ measures memory access timing.
Question
After you have installed a processor, what should you do if you turn on the system and power comes on but you don't see any output on the screen and the system does not seem to be going through its normal boot procedure?
Question
Which of the following is NOT a necessary precaution when installing memory modules?

A) use a ground bracelet
B) test the motherboard for residual electrical charges
C) unplug the computer
D) don't stack modules on top of each other
Question
What are the three category of DDR memory and how do they compare with regular SDRAM and each other?
Question
What technology in a DIMM informs the BIOS of the module's size, speed, voltage, and data path width?

A) SPD
B) ECC
C) Buffers
D) DDR
Question
List and describe the components found in a Pentium processor.
Question
The speed at which the processor operates internally is called the processor ____________.
Question
After you install a processor, you should check the _____________ to verify that the system recognized the processor correctly.
Question
Describe the three levels of cache used by a processor.
Question
Discuss how the processor frequency and the Front Side Bus frequency are related.
Question
Describe the step of processor installation that involves the application of thermal compound.
Question
What are the current AMD processor families?
Question
There are five questions that you should answer before adding memory to a system. List three of those five.
Question
A DIMM that holds data and amplifies a signal before the data is written to the module uses which technology?

A) EDO
B) registers
C) parity
D) CAS
Question
There are nine features that affect performance and compatibility of a processor with the motherboard. List four of them.
Question
_________________________ is the ability of a processor to execute two instructions at the same time.
Question
Which of the following memory configurations definitely will not work when populating a motherboard with DIMMs?

A) using two different manufacturer's memory
B) mixing memory speeds
C) leaving a slot unpopulated
D) mixing unbuffered with registered
Question
Match between columns
a placeholder module used in Rambus memory configurations
ECC
a placeholder module used in Rambus memory configurations
RDRAM
a placeholder module used in Rambus memory configurations
dual ranked
a placeholder module used in Rambus memory configurations
parity
a placeholder module used in Rambus memory configurations
Hyper-Threading
a placeholder module used in Rambus memory configurations
RAS Latency
a placeholder module used in Rambus memory configurations
thread
a placeholder module used in Rambus memory configurations
C-RIMM
a placeholder module used in Rambus memory configurations
single-sided
a placeholder module used in Rambus memory configurations
multiplier
an error checking technology used by SIMMs
ECC
an error checking technology used by SIMMs
RDRAM
an error checking technology used by SIMMs
dual ranked
an error checking technology used by SIMMs
parity
an error checking technology used by SIMMs
Hyper-Threading
an error checking technology used by SIMMs
RAS Latency
an error checking technology used by SIMMs
thread
an error checking technology used by SIMMs
C-RIMM
an error checking technology used by SIMMs
single-sided
an error checking technology used by SIMMs
multiplier
the number of clock cycles it takes to write or read a row of data
ECC
the number of clock cycles it takes to write or read a row of data
RDRAM
the number of clock cycles it takes to write or read a row of data
dual ranked
the number of clock cycles it takes to write or read a row of data
parity
the number of clock cycles it takes to write or read a row of data
Hyper-Threading
the number of clock cycles it takes to write or read a row of data
RAS Latency
the number of clock cycles it takes to write or read a row of data
thread
the number of clock cycles it takes to write or read a row of data
C-RIMM
the number of clock cycles it takes to write or read a row of data
single-sided
the number of clock cycles it takes to write or read a row of data
multiplier
memory chips installed on one side of the module
ECC
memory chips installed on one side of the module
RDRAM
memory chips installed on one side of the module
dual ranked
memory chips installed on one side of the module
parity
memory chips installed on one side of the module
Hyper-Threading
memory chips installed on one side of the module
RAS Latency
memory chips installed on one side of the module
thread
memory chips installed on one side of the module
C-RIMM
memory chips installed on one side of the module
single-sided
memory chips installed on one side of the module
multiplier
a Rambus memory module
ECC
a Rambus memory module
RDRAM
a Rambus memory module
dual ranked
a Rambus memory module
parity
a Rambus memory module
Hyper-Threading
a Rambus memory module
RAS Latency
a Rambus memory module
thread
a Rambus memory module
C-RIMM
a Rambus memory module
single-sided
a Rambus memory module
multiplier
an error checking technology used by DIMMs
ECC
an error checking technology used by DIMMs
RDRAM
an error checking technology used by DIMMs
dual ranked
an error checking technology used by DIMMs
parity
an error checking technology used by DIMMs
Hyper-Threading
an error checking technology used by DIMMs
RAS Latency
an error checking technology used by DIMMs
thread
an error checking technology used by DIMMs
C-RIMM
an error checking technology used by DIMMs
single-sided
an error checking technology used by DIMMs
multiplier
a task or group of instructions executed by the CPU
ECC
a task or group of instructions executed by the CPU
RDRAM
a task or group of instructions executed by the CPU
dual ranked
a task or group of instructions executed by the CPU
parity
a task or group of instructions executed by the CPU
Hyper-Threading
a task or group of instructions executed by the CPU
RAS Latency
a task or group of instructions executed by the CPU
thread
a task or group of instructions executed by the CPU
C-RIMM
a task or group of instructions executed by the CPU
single-sided
a task or group of instructions executed by the CPU
multiplier
a technology that allows a processor to handle more than one group of instructions
ECC
a technology that allows a processor to handle more than one group of instructions
RDRAM
a technology that allows a processor to handle more than one group of instructions
dual ranked
a technology that allows a processor to handle more than one group of instructions
parity
a technology that allows a processor to handle more than one group of instructions
Hyper-Threading
a technology that allows a processor to handle more than one group of instructions
RAS Latency
a technology that allows a processor to handle more than one group of instructions
thread
a technology that allows a processor to handle more than one group of instructions
C-RIMM
a technology that allows a processor to handle more than one group of instructions
single-sided
a technology that allows a processor to handle more than one group of instructions
multiplier
the factor used to determine clock speed between the processor and FSB
ECC
the factor used to determine clock speed between the processor and FSB
RDRAM
the factor used to determine clock speed between the processor and FSB
dual ranked
the factor used to determine clock speed between the processor and FSB
parity
the factor used to determine clock speed between the processor and FSB
Hyper-Threading
the factor used to determine clock speed between the processor and FSB
RAS Latency
the factor used to determine clock speed between the processor and FSB
thread
the factor used to determine clock speed between the processor and FSB
C-RIMM
the factor used to determine clock speed between the processor and FSB
single-sided
the factor used to determine clock speed between the processor and FSB
multiplier
double-sided DIMMs that provide more than one bank
ECC
double-sided DIMMs that provide more than one bank
RDRAM
double-sided DIMMs that provide more than one bank
dual ranked
double-sided DIMMs that provide more than one bank
parity
double-sided DIMMs that provide more than one bank
Hyper-Threading
double-sided DIMMs that provide more than one bank
RAS Latency
double-sided DIMMs that provide more than one bank
thread
double-sided DIMMs that provide more than one bank
C-RIMM
double-sided DIMMs that provide more than one bank
single-sided
double-sided DIMMs that provide more than one bank
multiplier
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Deck 5: Supporting Processors and Upgrading Memory
1
Today's DIMMs use a 64-bit data path.
True
2
Which of the following is NOT a feature of a processor?

A) clock speed
B) processor architecture
C) amount of CMOS
D) multi-core processing
C
3
After installing the processor, if the system begins the boot process and suddenly turns off before completing the boot, the processor is most likely overheating.
True
4
When installing a processor, you must line up the red circle on the processor with the right-angle mark on the motherboard.
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5
Which of the following is true about DIMM technologies?

A) DDR2 uses 184 pins
B) DDR3 is backward compatible with DDR2
C) SDRAM runs synchronized with the system clock
D) the S in SDRAM stands for static
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k this deck
6
Which of the following is true about installing a processor on a motherboard?

A) after placing the processor in the socket, you need to lock down the lever
B) it's okay to reuse thermal compound when you remove and reinstall a processor
C) processors are protected from ESD, so you don't need a grounding bracelet
D) use plenty of thermal compound, you can never use too much of this substance
Unlock Deck
Unlock for access to all 41 flashcards in this deck.
Unlock Deck
k this deck
7
Which type of memory is the main memory installed as DIMMs on a motherboard?

A) SRAM
B) CMOS RAM
C) DRAM
D) Flash RAM
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k this deck
8
Multiple processors can be installed in a single processor housing.
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k this deck
9
Which of the following is NOT a component of a processor?

A) device driver
B) control unit
C) registers
D) memory caches
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k this deck
10
The two major manufacturers of processors are Intel and NVIDIA.
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k this deck
11
What is the most likely result of a correctly installed processor, but an incorrectly installed cooler?

A) powers on, but nothing else happens
B) boot process begins, but system suddenly turns off after a short period
C) system does not power on at all
D) BIOS setup does not recognize the processor correctly
Unlock Deck
Unlock for access to all 41 flashcards in this deck.
Unlock Deck
k this deck
12
What unit of measurement is used for DIMM read and write times?

A) milliseconds
B) microseconds
C) nanoseconds
D) picoseconds
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k this deck
13
DIMMs used in servers can provide additional reliability if they use which of the following technologies?

A) EDO
B) dual ranked
C) ECC
D) PC3
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k this deck
14
Which of the following is true about DIMM slots?

A) color coding is used to identify the channel
B) DDR2 and DDR3 support triple channels
C) DDR only supports a single channel
D) a DDR3 DIMM allows access to four memory chips simultaneously on each DIMM
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Unlock for access to all 41 flashcards in this deck.
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k this deck
15
Which type of memory can support quad, triple, and dual channels?

A) DDR3
B) DDR2
C) DDR
D) RIMM
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k this deck
16
Which type of processor memory is located on the processor chip (processor die)?

A) Level 0 cache
B) Level 1 cache
C) Level 2 cache
D) Level 3 cache
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k this deck
17
Which Intel processor technology interconnects the processor, chipset, and wireless network adapter as a unit, improving laptop performance?

A) Pentium
B) Core i5
C) Celeron
D) Centrino
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Unlock for access to all 41 flashcards in this deck.
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k this deck
18
What is the transfer rate of a 64-bit module running at 1600 MHz?

A) 1600 MB\second
B) 3200 MB\second
C) 6400 MB\second
D) 12800 MB\second
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k this deck
19
Which of the following statements is NOT true when setting up dual channeling?

A) a pair in a channel must be equally matched in size, speed and features
B) if two DIMM slots do not have matching pairs, single-channeling will be used
C) each channel runs independently of the other channel
D) if you have two pairs installed in two channels, all four DIMMs must match
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20
What is the general name of the processor feature that AMD calls HyperTransport?

A) multi-core processing
B) multithreading
C) virtualization support
D) integrated graphics
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k this deck
21
List the four major categories of memory modules and mention how they are used today.
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22
The __________________ family of AMD processors has processors that run up to 3.2 GHz, have up to 6 cores, and use the AM3 socket.
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23
Which memory technology that is no longer used has a 32-bit data bus, 232 pins and requires a placeholder in empty slots?

A) CAS RAM
B) SO-DIMM
C) RIMM
D) SIMM
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24
CAS _____________ measures memory access timing.
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25
After you have installed a processor, what should you do if you turn on the system and power comes on but you don't see any output on the screen and the system does not seem to be going through its normal boot procedure?
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k this deck
26
Which of the following is NOT a necessary precaution when installing memory modules?

A) use a ground bracelet
B) test the motherboard for residual electrical charges
C) unplug the computer
D) don't stack modules on top of each other
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k this deck
27
What are the three category of DDR memory and how do they compare with regular SDRAM and each other?
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28
What technology in a DIMM informs the BIOS of the module's size, speed, voltage, and data path width?

A) SPD
B) ECC
C) Buffers
D) DDR
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29
List and describe the components found in a Pentium processor.
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30
The speed at which the processor operates internally is called the processor ____________.
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31
After you install a processor, you should check the _____________ to verify that the system recognized the processor correctly.
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32
Describe the three levels of cache used by a processor.
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33
Discuss how the processor frequency and the Front Side Bus frequency are related.
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34
Describe the step of processor installation that involves the application of thermal compound.
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35
What are the current AMD processor families?
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36
There are five questions that you should answer before adding memory to a system. List three of those five.
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37
A DIMM that holds data and amplifies a signal before the data is written to the module uses which technology?

A) EDO
B) registers
C) parity
D) CAS
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38
There are nine features that affect performance and compatibility of a processor with the motherboard. List four of them.
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39
_________________________ is the ability of a processor to execute two instructions at the same time.
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40
Which of the following memory configurations definitely will not work when populating a motherboard with DIMMs?

A) using two different manufacturer's memory
B) mixing memory speeds
C) leaving a slot unpopulated
D) mixing unbuffered with registered
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41
Match between columns
a placeholder module used in Rambus memory configurations
ECC
a placeholder module used in Rambus memory configurations
RDRAM
a placeholder module used in Rambus memory configurations
dual ranked
a placeholder module used in Rambus memory configurations
parity
a placeholder module used in Rambus memory configurations
Hyper-Threading
a placeholder module used in Rambus memory configurations
RAS Latency
a placeholder module used in Rambus memory configurations
thread
a placeholder module used in Rambus memory configurations
C-RIMM
a placeholder module used in Rambus memory configurations
single-sided
a placeholder module used in Rambus memory configurations
multiplier
an error checking technology used by SIMMs
ECC
an error checking technology used by SIMMs
RDRAM
an error checking technology used by SIMMs
dual ranked
an error checking technology used by SIMMs
parity
an error checking technology used by SIMMs
Hyper-Threading
an error checking technology used by SIMMs
RAS Latency
an error checking technology used by SIMMs
thread
an error checking technology used by SIMMs
C-RIMM
an error checking technology used by SIMMs
single-sided
an error checking technology used by SIMMs
multiplier
the number of clock cycles it takes to write or read a row of data
ECC
the number of clock cycles it takes to write or read a row of data
RDRAM
the number of clock cycles it takes to write or read a row of data
dual ranked
the number of clock cycles it takes to write or read a row of data
parity
the number of clock cycles it takes to write or read a row of data
Hyper-Threading
the number of clock cycles it takes to write or read a row of data
RAS Latency
the number of clock cycles it takes to write or read a row of data
thread
the number of clock cycles it takes to write or read a row of data
C-RIMM
the number of clock cycles it takes to write or read a row of data
single-sided
the number of clock cycles it takes to write or read a row of data
multiplier
memory chips installed on one side of the module
ECC
memory chips installed on one side of the module
RDRAM
memory chips installed on one side of the module
dual ranked
memory chips installed on one side of the module
parity
memory chips installed on one side of the module
Hyper-Threading
memory chips installed on one side of the module
RAS Latency
memory chips installed on one side of the module
thread
memory chips installed on one side of the module
C-RIMM
memory chips installed on one side of the module
single-sided
memory chips installed on one side of the module
multiplier
a Rambus memory module
ECC
a Rambus memory module
RDRAM
a Rambus memory module
dual ranked
a Rambus memory module
parity
a Rambus memory module
Hyper-Threading
a Rambus memory module
RAS Latency
a Rambus memory module
thread
a Rambus memory module
C-RIMM
a Rambus memory module
single-sided
a Rambus memory module
multiplier
an error checking technology used by DIMMs
ECC
an error checking technology used by DIMMs
RDRAM
an error checking technology used by DIMMs
dual ranked
an error checking technology used by DIMMs
parity
an error checking technology used by DIMMs
Hyper-Threading
an error checking technology used by DIMMs
RAS Latency
an error checking technology used by DIMMs
thread
an error checking technology used by DIMMs
C-RIMM
an error checking technology used by DIMMs
single-sided
an error checking technology used by DIMMs
multiplier
a task or group of instructions executed by the CPU
ECC
a task or group of instructions executed by the CPU
RDRAM
a task or group of instructions executed by the CPU
dual ranked
a task or group of instructions executed by the CPU
parity
a task or group of instructions executed by the CPU
Hyper-Threading
a task or group of instructions executed by the CPU
RAS Latency
a task or group of instructions executed by the CPU
thread
a task or group of instructions executed by the CPU
C-RIMM
a task or group of instructions executed by the CPU
single-sided
a task or group of instructions executed by the CPU
multiplier
a technology that allows a processor to handle more than one group of instructions
ECC
a technology that allows a processor to handle more than one group of instructions
RDRAM
a technology that allows a processor to handle more than one group of instructions
dual ranked
a technology that allows a processor to handle more than one group of instructions
parity
a technology that allows a processor to handle more than one group of instructions
Hyper-Threading
a technology that allows a processor to handle more than one group of instructions
RAS Latency
a technology that allows a processor to handle more than one group of instructions
thread
a technology that allows a processor to handle more than one group of instructions
C-RIMM
a technology that allows a processor to handle more than one group of instructions
single-sided
a technology that allows a processor to handle more than one group of instructions
multiplier
the factor used to determine clock speed between the processor and FSB
ECC
the factor used to determine clock speed between the processor and FSB
RDRAM
the factor used to determine clock speed between the processor and FSB
dual ranked
the factor used to determine clock speed between the processor and FSB
parity
the factor used to determine clock speed between the processor and FSB
Hyper-Threading
the factor used to determine clock speed between the processor and FSB
RAS Latency
the factor used to determine clock speed between the processor and FSB
thread
the factor used to determine clock speed between the processor and FSB
C-RIMM
the factor used to determine clock speed between the processor and FSB
single-sided
the factor used to determine clock speed between the processor and FSB
multiplier
double-sided DIMMs that provide more than one bank
ECC
double-sided DIMMs that provide more than one bank
RDRAM
double-sided DIMMs that provide more than one bank
dual ranked
double-sided DIMMs that provide more than one bank
parity
double-sided DIMMs that provide more than one bank
Hyper-Threading
double-sided DIMMs that provide more than one bank
RAS Latency
double-sided DIMMs that provide more than one bank
thread
double-sided DIMMs that provide more than one bank
C-RIMM
double-sided DIMMs that provide more than one bank
single-sided
double-sided DIMMs that provide more than one bank
multiplier
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