Deck 30: Processing of Integrated Circuits

Question 1

Silicon is the most widely used semiconductor material for integrated circuits.Which of the following are less common semiconductor materials used for ICs (two best answers):

A)boron,
B)boron nitride
C)gallium arsenide
D)germanium
E)silicon carbide
F)silicon dioxide
G)zirconium

Answer 1

gallium arsenide
germanium

Question 2

How many electronic devices would be contained in an IC chip in order for it to be classified in the VLSI category (one best answer):

A)1000,
B)10000
C)1 million
D)100 million

Answer 2

1 million

Question 3

An alternative name for chip in semiconductor processing is which one of the following (one best answer):

A)component,
B)device
C)die
D)package
E)wafer

Answer 3

die

Question 4

Which one of the following is the source of silicon for semiconductor processing:

A)pure Si found in nature,
B)SiC
C)Si₃N₄
D)SiO₂

Question 5

Silicon that has been grown from a melt into a large single-crystal ingot by the Czochralski process is called which one of the following:

A)boule,
B)crystallite
C)crystalloid
D)transistor
E)wafer

Question 6

The air in a clean room is passed through a HEPA filter.HEPA stands for which one of the following:

A)high-efficiency packaging amplifier,
B)high-efficiency passive arresting
C)high-efficiency particulate air
D)high-energy processing action
E)high-energy particle attenuation

Question 7

Which one of the following is the most common form of radiation used in photolithography:

A)electronic beam radiation,
B)incandescent light
C)infrared light
D)ultraviolet light
E)X-ray

Question 8

After exposure to light, a positive resist becomes

A)less soluble
B)more soluble to the chemical developing fluid.

Question 9

A silicon dioxide film formed on the surface of a silicon wafer by thermal oxidation has a thickness that is

A)greater than,
B)less than
C)the same as the layer of substrate silicon used to form it.

Question 10

Which one of the following is not one of the functions of silicon dioxide in semiconductor processing:

A)provides electrical insulation between levels in multilevel metallization systems,
B)serves as a conducting path between levels in multilevel metallization systems
C)serves as a mask to prevent diffusion of dopants into silicon
D)serves to isolate devices in a circuit

Question 11

Epitaxial deposition refers to a process of growing a film onto a substrate so that the film has a crystalline structure that is an extension of the substrate's structure:

Question 12

Vapor phase epitaxy is based on which one of the following:

A)chemical vapor deposition,
B)diffusion
C)ion implantation
D)physical vapor deposition
E)thermal oxidation

Question 13

Which of the following processes are used to add layers of various materials in IC fabrication (three best answers):

A)chemical vapor deposition,
B)diffusion
C)ion implantation
D)physical vapor deposition
E)plasma etching
F)thermal oxidation
G)wet etching

Question 14

Which of the following are doping processes in IC fabrication (two best answers):

A)chemical vapor deposition,
B)diffusion
C)ion implantation
D)physical vapor deposition
E)plasma etching
F)thermal oxidation
G)wet etching

Question 15

Which one of the following is the most common metal for metallization in a silicon integrated circuit:

A)aluminum,
B)copper
C)gold
D)nickel
E)silicon
F)silver

Question 16

Which etching process produces the more anisotropic etch in IC fabrication:

A)plasma etching
B)wet chemical etching

Question 17

Which of the following are the two principal packaging materials used in IC packaging:

A)aluminum,
B)aluminum oxide
C)copper
D)epoxies
E)silicon dioxide

Question 18

According to Rent's rule the number of input/output terminals in an integrated circuit is

A)greater than
B)less than the number of devices (logic gates) in the IC

Question 19

Which one of the following technologies in IC packaging provides the greater packing densities in circuit board assembly:

A)pin-in-hole technology,
B)surface-mount technology
C)through-hole technology

Question 20

Which one of the following IC packaging styles provides the opportunity for the largest number of terminals in the package:

A)ball grid array,
B)dual in-line package
C)pin grid array
D)square package

Question 21

Multiprobe testing is a computer-controlled testing method that is performed on the integrated circuits immediately after they have been separated from the wafer:

Question 22

Which of the following metals are commonly used for wire bonding of chip pads to the lead frame (two best answers):

A)aluminum,
B)copper
C)gold
D)nickel
E)silicon
F)silver

Question 23

Which one of the following major phases in IC processing is the most important in determining the overall yield of ICs:

A)chip separation from the wafer,
B)crystal growing of the starting ingot
C)packaging of the individual ICs
D)slicing the ingot into wafers
E)wafer processing of the individual ICs on the wafer