Question 1

Which one of the following is the source of silicon for semiconductor processing:

Accepted Answer

A) pure Si found in nature, 
B) SiC 
C) Si3N4 
D) SiO2 
A) pure Si found in nature, 
B) SiC 
C) Si3N4 
D) SiO2 D

Question 2

Which of the following processes are used to add layers of various materials in IC fabrication (three best answers):

Accepted Answer

A) chemical vapor deposition, 
B) diffusion 
C) ion implantation 
D) physical vapor deposition 
E) plasma etching
F)thermal oxidation
G)wet etching 
A) chemical vapor deposition, 
B) diffusion 
C) ion implantation 
D) physical vapor deposition 
E) plasma etching
F)thermal oxidation
G)wet etching A, D, F

Question 3

Which of the following metals are commonly used for wire bonding of chip pads to the lead frame (two best answers):

Accepted Answer

A) aluminum, 
B) copper 
C) gold 
D) nickel 
E) silicon
F)silver 
A) aluminum, 
B) copper 
C) gold 
D) nickel 
E) silicon
F)silver A , C

Question 4

Which one of the following IC packaging styles provides the opportunity for the largest number of terminals in the package:

Accepted Answer

A) ball grid array, 
B) dual in-line package 
C) pin grid array 
D) square package 
A) ball grid array, 
B) dual in-line package 
C) pin grid array 
D) square package

Question 5

Which one of the following is the most common metal for metallization in a silicon integrated circuit:

Accepted Answer

A) aluminum, 
B) copper 
C) gold 
D) nickel 
E) silicon
F)silver 
A) aluminum, 
B) copper 
C) gold 
D) nickel 
E) silicon
F)silver

Question 6

Epitaxial deposition refers to a process of growing a film onto a substrate so that the film has a crystalline structure that is an extension of the substrate's structure:

Accepted Answer

A) True 
 B)False

Question 7

Which one of the following technologies in IC packaging provides the greater packing densities in circuit board assembly:

Accepted Answer

A) pin-in-hole technology, 
B) surface-mount technology 
C) through-hole technology 
A) pin-in-hole technology, 
B) surface-mount technology 
C) through-hole technology

Question 8

Which one of the following is the most common form of radiation used in photolithography:

Accepted Answer

A) electronic beam radiation, 
B) incandescent light 
C) infrared light 
D) ultraviolet light 
E) X-ray 
A) electronic beam radiation, 
B) incandescent light 
C) infrared light 
D) ultraviolet light 
E) X-ray

Question 9

A silicon dioxide film formed on the surface of a silicon wafer by thermal oxidation has a thickness that is

Accepted Answer

A) greater than, 
B) less than 
C) the same as the layer of substrate silicon used to form it. 
A) greater than, 
B) less than 
C) the same as the layer of substrate silicon used to form it.

Question 10

Which of the following are the two principal packaging materials used in IC packaging:

Accepted Answer

A) aluminum, 
B) aluminum oxide 
C) copper 
D) epoxies 
E) silicon dioxide 
A) aluminum, 
B) aluminum oxide 
C) copper 
D) epoxies 
E) silicon dioxide

Question 11

Vapor phase epitaxy is based on which one of the following:

Accepted Answer

A) chemical vapor deposition, 
B) diffusion 
C) ion implantation 
D) physical vapor deposition 
E) thermal oxidation 
A) chemical vapor deposition, 
B) diffusion 
C) ion implantation 
D) physical vapor deposition 
E) thermal oxidation

Question 12

After exposure to light, a positive resist becomes

Accepted Answer

A) less soluble 
B) more soluble to the chemical developing fluid. 
A) less soluble 
B) more soluble to the chemical developing fluid.

Question 13

The air in a clean room is passed through a HEPA filter.HEPA stands for which one of the following:

Accepted Answer

A) high-efficiency packaging amplifier, 
B) high-efficiency passive arresting 
C) high-efficiency particulate air 
D) high-energy processing action 
E) high-energy particle attenuation 
A) high-efficiency packaging amplifier, 
B) high-efficiency passive arresting 
C) high-efficiency particulate air 
D) high-energy processing action 
E) high-energy particle attenuation

Question 14

According to Rent's rule the number of input/output terminals in an integrated circuit is

Accepted Answer

A) greater than 
B) less than the number of devices (logic gates) in the IC 
A) greater than 
B) less than the number of devices (logic gates) in the IC

Question 15

Which one of the following is not one of the functions of silicon dioxide in semiconductor processing:

Accepted Answer

A) provides electrical insulation between levels in multilevel metallization systems, 
B) serves as a conducting path between levels in multilevel metallization systems 
C) serves as a mask to prevent diffusion of dopants into silicon 
D) serves to isolate devices in a circuit 
A) provides electrical insulation between levels in multilevel metallization systems, 
B) serves as a conducting path between levels in multilevel metallization systems 
C) serves as a mask to prevent diffusion of dopants into silicon 
D) serves to isolate devices in a circuit

Question 16

Which etching process produces the more anisotropic etch in IC fabrication:

Accepted Answer

A) plasma etching 
B) wet chemical etching 
A) plasma etching 
B) wet chemical etching

Question 17

Which of the following are doping processes in IC fabrication (two best answers):

Accepted Answer

A) chemical vapor deposition, 
B) diffusion 
C) ion implantation 
D) physical vapor deposition 
E) plasma etching
F)thermal oxidation
G)wet etching 
A) chemical vapor deposition, 
B) diffusion 
C) ion implantation 
D) physical vapor deposition 
E) plasma etching
F)thermal oxidation
G)wet etching

Question 18

Silicon is the most widely used semiconductor material for integrated circuits.Which of the following are less common semiconductor materials used for ICs (two best answers):

Accepted Answer

A) boron, 
B) boron nitride 
C) gallium arsenide 
D) germanium 
E) silicon carbide
F)silicon dioxide
G)zirconium 
A) boron, 
B) boron nitride 
C) gallium arsenide 
D) germanium 
E) silicon carbide
F)silicon dioxide
G)zirconium

Question 19

An alternative name for chip in semiconductor processing is which one of the following (one best answer):

Accepted Answer

A) component, 
B) device 
C) die 
D) package 
E) wafer 
A) component, 
B) device 
C) die 
D) package 
E) wafer

Question 20

Which one of the following major phases in IC processing is the most important in determining the overall yield of ICs:

Accepted Answer

A) chip separation from the wafer, 
B) crystal growing of the starting ingot 
C) packaging of the individual ICs 
D) slicing the ingot into wafers 
E) wafer processing of the individual ICs on the wafer 
A) chip separation from the wafer, 
B) crystal growing of the starting ingot 
C) packaging of the individual ICs 
D) slicing the ingot into wafers 
E) wafer processing of the individual ICs on the wafer

Exam 30: Processing of Integrated Circuits

Which one of the following is the source of silicon for semiconductor processing:

Which of the following processes are used to add layers of various materials in IC fabrication (three best answers):

Which of the following metals are commonly used for wire bonding of chip pads to the lead frame (two best answers):

Which one of the following IC packaging styles provides the opportunity for the largest number of terminals in the package:

Which one of the following is the most common metal for metallization in a silicon integrated circuit:

Epitaxial deposition refers to a process of growing a film onto a substrate so that the film has a crystalline structure that is an extension of the substrate's structure:

Which one of the following technologies in IC packaging provides the greater packing densities in circuit board assembly:

Which one of the following is the most common form of radiation used in photolithography:

A silicon dioxide film formed on the surface of a silicon wafer by thermal oxidation has a thickness that is

Which of the following are the two principal packaging materials used in IC packaging:

Vapor phase epitaxy is based on which one of the following:

After exposure to light, a positive resist becomes

The air in a clean room is passed through a HEPA filter.HEPA stands for which one of the following:

According to Rent's rule the number of input/output terminals in an integrated circuit is

Which one of the following is not one of the functions of silicon dioxide in semiconductor processing:

Which etching process produces the more anisotropic etch in IC fabrication:

Which of the following are doping processes in IC fabrication (two best answers):

Silicon is the most widely used semiconductor material for integrated circuits.Which of the following are less common semiconductor materials used for ICs (two best answers):

An alternative name for chip in semiconductor processing is which one of the following (one best answer):

Which one of the following major phases in IC processing is the most important in determining the overall yield of ICs:

Introduction and Overview of Manufacturing

The Nature of Materials

Mechanical Properties of Materials

Physical Properties of Materials

Engineering Materials

Dimensions, Surfaces, and Their Measurement

Fundamentals of Metal Casting

Metal Casting Processes

Glassworking

Shaping Processes for Plastics

Processing of Polymer Matrix Composites and Rubber

Powder Metallurgy

Processing of Ceramics and Cermets

Fundamentals of Metal Forming

Bulk Deformation Processes in Metal Workiing

Sheet Metalworking

Theory of Metal Machining

Machining Operations and Machine Tools

Cutting Tool Technology

Economic and Product Design Considerations

Grinding and Other Abrasive Processes

Nontraditional Machining and Thermal Cutting

Heat Treatment of Metals

Surface Processing Operations

Fundamentals of Welding

Welding Processes

Brazing, Soldering, and Adhesive Bonding

Mechanical Assembly

Rapid Prototyping and Additive Manufacturing

Electronics Assembly and Packaging

Microfabrication Technologies

Nanofabrication Technologies

Automation Technologies for Manufacturing Systems

Integrated Manufacturing Systems

Process Planning and Production Control

Quality Control and Inspection

Filters