Multiple Choice
Which of the following polymeric materials is commonly used as an ingredient in the insulation layer of a printed circuit board (two correct answers) :
A) copper
B) E-glass
C) epoxy
D) phenolic
E) polyethylene
F) polypropylene
Correct Answer:

Verified
Correct Answer:
Verified
Related Questions
Q3: Typical thickness of the copper layer in
Q4: In the adhesive bonding and wave soldering
Q5: The solder paste and reflow soldering method
Q6: Card-on-board (COB) packaging refers to which one
Q7: Which of the following electrical connection methods
Q9: Which of the following plating processes has
Q10: Which of the following are the soldering
Q11: Several types of holes must be created
Q12: Hand soldering is sometimes used after wave
Q13: In the subtractive circuitization method used to