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    Engineering
  3. Study Set
    Fundamentals of Modern Manufacturing
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    Exam 31: Electronics Assembly and Packaging
  5. Question
    Which of the Following Plating Processes Has the Higher Deposition
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Which of the Following Plating Processes Has the Higher Deposition

Question 9

Question 9

Multiple Choice

Which of the following plating processes has the higher deposition rate in PCB fabrication:


A) electroless plating
B) electroplating

Correct Answer:

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