Multiple Choice
In the solder paste and reflow soldering method of affixing components in surface-mount technology, the methods of applying the solder paste to the surface of the printed circuit board include which of the following (two best answers) :
A) automated placement machines
B) hand painting
C) photolithography
D) screen printing
E) semiautomatic placement machines
F) syringe dispensing
Correct Answer:
Verified
Correct Answer:
Verified
Q6: Card-on-board (COB) packaging refers to which one
Q7: Which of the following electrical connection methods
Q8: Which of the following polymeric materials is
Q9: Which of the following plating processes has
Q10: Which of the following are the soldering
Q11: Several types of holes must be created
Q12: Hand soldering is sometimes used after wave
Q13: In the subtractive circuitization method used to
Q15: Surface-mount technology is used at which one
Q16: The first level of packaging refers to