Multiple Choice
The first level of packaging refers to which one of the following:
A) Chip-to-package interconnections to form an IC package
B) circuit board to rack
C) IC package to printed circuit board
D) intraconnections on the IC chip
E) wiring and cabling connections in the cabinet
Correct Answer:
Verified
Correct Answer:
Verified
Q6: Card-on-board (COB) packaging refers to which one
Q7: Which of the following electrical connection methods
Q8: Which of the following polymeric materials is
Q9: Which of the following plating processes has
Q10: Which of the following are the soldering
Q11: Several types of holes must be created
Q12: Hand soldering is sometimes used after wave
Q13: In the subtractive circuitization method used to
Q14: In the solder paste and reflow soldering
Q15: Surface-mount technology is used at which one