Question 1

Twinning is which of the following (three best answers):

Accepted Answer

A) elastic deformation 
B) mechanism of plastic deformation 
C) more likely at high deformation rates 
D) more likely in metals with HCP structure 
E) slip mechanism
F)type of dislocation 
A) elastic deformation 
B) mechanism of plastic deformation 
C) more likely at high deformation rates 
D) more likely in metals with HCP structure 
E) slip mechanism
F)type of dislocation B, C, D

Question 2

Ceramics are characterized by which two of the following bonding types:

Accepted Answer

A) adhesive 
B) covalent 
C) hydrogen 
D) ionic 
E) metallic
F)van der Waals 
A) adhesive 
B) covalent 
C) hydrogen 
D) ionic 
E) metallic
F)van der Waals B , D

Question 3

Which one of the following crystal structures has the fewest slip directions and therefore the metals with this structure are generally more difficult to deform at room temperature:

Accepted Answer

A) BCC 
B) FCC 
C) HCP 
A) BCC 
B) FCC 
C) HCP C

Question 4

Approximately how many different elements have been identified (one best answer):

Accepted Answer

A) 10 
B) 50 
C) 100 
D) 200 
E) 500 
A) 10 
B) 50 
C) 100 
D) 200 
E) 500

Question 5

In general, ceramics are characterized by which of the following properties (four best answers):

Accepted Answer

A) brittleness 
B) chemical inertness 
C) electrically insulating 
D) high electrical conductivity 
E) high hardness
F)high thermal conductivity
G)low density
H)low thermal conductivity 
A) brittleness 
B) chemical inertness 
C) electrically insulating 
D) high electrical conductivity 
E) high hardness
F)high thermal conductivity
G)low density
H)low thermal conductivity

Question 6

In general, polymers are characterized by which of the following properties (three best answers):

Accepted Answer

A) brittleness 
B) chemical inertness 
C) electrically insulating 
D) high electrical conductivity 
E) high hardness
F)high thermal conductivity
G)low density
H)low thermal conductivity 
A) brittleness 
B) chemical inertness 
C) electrically insulating 
D) high electrical conductivity 
E) high hardness
F)high thermal conductivity
G)low density
H)low thermal conductivity

Question 7

Which of the following bond types are classified as primary bonds (three correct answers):

Accepted Answer

A) covalent bonding 
B) hydrogen bonding 
C) ionic bonding 
D) metallic bonding 
E) van der Waals forces 
A) covalent bonding 
B) hydrogen bonding 
C) ionic bonding 
D) metallic bonding 
E) van der Waals forces

Question 8

The basic structural unit of matter is which one of the following:

Accepted Answer

A) atom 
B) electron 
C) element 
D) molecule 
E) nucleus 
A) atom 
B) electron 
C) element 
D) molecule 
E) nucleus

Question 9

Which of the following are point defects in a crystal lattice structure (three correct answers):

Accepted Answer

A) edge dislocation 
B) grain boundaries 
C) interstitialcy 
D) Schottky defect 
E) screw dislocation
F)Vacancy 
A) edge dislocation 
B) grain boundaries 
C) interstitialcy 
D) Schottky defect 
E) screw dislocation
F)Vacancy

Question 10

The element with the lowest density and smallest atomic weight is which one of the following:

Accepted Answer

A) aluminum 
B) argon 
C) helium 
D) hydrogen 
E) magnesium 
A) aluminum 
B) argon 
C) helium 
D) hydrogen 
E) magnesium

Question 11

How many atoms are there in the hexagonal close-packed (HCP) unit cell (one correct answer):

Accepted Answer

A) 8 
B) 9 
C) 10 
D) 12 
E) 14
F)17 
A) 8 
B) 9 
C) 10 
D) 12 
E) 14
F)17

Question 12

How many atoms are there in the face-centered cubic (FCC) unit cell (one correct answer):

Accepted Answer

A) 8 
B) 9 
C) 10 
D) 12 
E) 14
F)17 
A) 8 
B) 9 
C) 10 
D) 12 
E) 14
F)17

Question 13

Metals are characterized by which one of the following bonding types:

Accepted Answer

A) adhesive 
B) covalent 
C) hydrogen 
D) ionic 
E) metallic
F)van der Waals 
A) adhesive 
B) covalent 
C) hydrogen 
D) ionic 
E) metallic
F)van der Waals

Question 14

Polymers are characterized by which two of the following bonding types:

Accepted Answer

A) adhesive 
B) covalent 
C) hydrogen 
D) ionic 
E) metallic
F)van der Waals 
A) adhesive 
B) covalent 
C) hydrogen 
D) ionic 
E) metallic
F)van der Waals

Question 15

How many atoms are there in the body-centered cubic (BCC) unit cell (one correct answer):

Accepted Answer

A) 8 
B) 9 
C) 10 
D) 12 
E) 14
F)17 
A) 8 
B) 9 
C) 10 
D) 12 
E) 14
F)17

Question 16

Grain boundaries are an example of which one of the following types of crystal structure defects:

Accepted Answer

A) dislocation 
B) Frenkel defect 
C) line defects 
D) point defects 
E) surface defects 
A) dislocation 
B) Frenkel defect 
C) line defects 
D) point defects 
E) surface defects

Question 17

In general, metals are characterized by which of the following properties (three best answers):

Accepted Answer

A) brittleness 
B) chemical inertness 
C) electrically insulating 
D) high electrical conductivity 
E) high hardness
F)high thermal conductivity
G)low density
H)low thermal conductivity 
A) brittleness 
B) chemical inertness 
C) electrically insulating 
D) high electrical conductivity 
E) high hardness
F)high thermal conductivity
G)low density
H)low thermal conductivity

Question 18

In the Periodic Table, the elements can be divided into which of the following categories (three best answers):

Accepted Answer

A) ceramics 
B) gases 
C) liquids 
D) metals 
E) nonmetals
F)polymers
G)Semi-metals
H)solids 
A) ceramics 
B) gases 
C) liquids 
D) metals 
E) nonmetals
F)polymers
G)Semi-metals
H)solids

Exam 2: The Nature of Materials

Twinning is which of the following (three best answers):

Ceramics are characterized by which two of the following bonding types:

Which one of the following crystal structures has the fewest slip directions and therefore the metals with this structure are generally more difficult to deform at room temperature:

Approximately how many different elements have been identified (one best answer):

In general, ceramics are characterized by which of the following properties (four best answers):

In general, polymers are characterized by which of the following properties (three best answers):

Which of the following bond types are classified as primary bonds (three correct answers):

The basic structural unit of matter is which one of the following:

Which of the following are point defects in a crystal lattice structure (three correct answers):

The element with the lowest density and smallest atomic weight is which one of the following:

How many atoms are there in the hexagonal close-packed (HCP) unit cell (one correct answer):

How many atoms are there in the face-centered cubic (FCC) unit cell (one correct answer):

Metals are characterized by which one of the following bonding types:

Polymers are characterized by which two of the following bonding types:

How many atoms are there in the body-centered cubic (BCC) unit cell (one correct answer):

Grain boundaries are an example of which one of the following types of crystal structure defects:

In general, metals are characterized by which of the following properties (three best answers):

In the Periodic Table, the elements can be divided into which of the following categories (three best answers):

Introduction and Overview of Manufacturing

Mechanical Properties of Materials

Physical Properties of Materials

Engineering Materials

Dimensions, Surfaces, and Their Measurement

Fundamentals of Metal Casting

Metal Casting Processes

Glassworking

Shaping Processes for Plastics

Processing of Polymer Matrix Composites and Rubber

Powder Metallurgy

Processing of Ceramics and Cermets

Fundamentals of Metal Forming

Bulk Deformation Processes in Metal Workiing

Sheet Metalworking

Theory of Metal Machining

Machining Operations and Machine Tools

Cutting Tool Technology

Economic and Product Design Considerations

Grinding and Other Abrasive Processes

Nontraditional Machining and Thermal Cutting

Heat Treatment of Metals

Surface Processing Operations

Fundamentals of Welding

Welding Processes

Brazing, Soldering, and Adhesive Bonding

Mechanical Assembly

Rapid Prototyping and Additive Manufacturing

Processing of Integrated Circuits

Electronics Assembly and Packaging

Microfabrication Technologies

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