Question 1

In general, which of the following technologies causes more problems during rework:

Accepted Answer

A) surface-mount technology 
B) through-hole technology 
A) surface-mount technology 
B) through-hole technology A

Question 2

In addition to copper, which one of the following is another common metal plated onto a PCB:

Accepted Answer

A) aluminum 
B) gold 
C) nickel 
D) tin 
A) aluminum 
B) gold 
C) nickel 
D) tin B

Question 3

Typical thickness of the copper layer in a printed circuit board is which one of the following:

Accepted Answer

A) 4 mm (0.160 in) 
B) 0.4 mm (0.016 in) 
C) 0.04 mm (0.0016 in) 
D) 0.004 mm (0.00016 in) 
A) 4 mm (0.160 in) 
B) 0.4 mm (0.016 in) 
C) 0.04 mm (0.0016 in) 
D) 0.004 mm (0.00016 in) C

Question 4

In the adhesive bonding and wave soldering method of affixing components in surface-mount technology, the components themselves pass through the molten solder wave:

Accepted Answer

A) True 
 B)False

Question 5

The solder paste and reflow soldering method of affixing components in surface-mount technology includes a wave soldering step to securely attach the components to the board:

Accepted Answer

A) True 
 B)False

Question 6

Card-on-board (COB) packaging refers to which one of the following packaging levels:

Accepted Answer

A) zero 
B) first 
C) second 
D) third 
E) fourth 
A) zero 
B) first 
C) second 
D) third 
E) fourth

Question 7

Which of the following electrical connection methods produce a separable connection (two correct answers):

Accepted Answer

A) crimping of terminals 
B) press fitting 
C) soldering 
D) terminal blocks 
E) sockets 
A) crimping of terminals 
B) press fitting 
C) soldering 
D) terminal blocks 
E) sockets

Question 8

Which of the following polymeric materials is commonly used as an ingredient in the insulation layer of a printed circuit board (two correct answers):

Accepted Answer

A) copper 
B) E-glass 
C) epoxy 
D) phenolic 
E) polyethylene
F)polypropylene 
A) copper 
B) E-glass 
C) epoxy 
D) phenolic 
E) polyethylene
F)polypropylene

Question 9

Which of the following plating processes has the higher deposition rate in PCB fabrication:

Accepted Answer

A) electroless plating 
B) electroplating 
A) electroless plating 
B) electroplating

Question 10

Which of the following are the soldering processes used to attach components to printed circuit boards in through-hole technology (two best answers):

Accepted Answer

A) hand soldering 
B) infrared soldering 
C) reflow soldering 
D) torch soldering 
E) wave soldering 
A) hand soldering 
B) infrared soldering 
C) reflow soldering 
D) torch soldering 
E) wave soldering

Question 11

Several types of holes must be created in a printed circuit board prior to assembly.Which one of the following hole types is not required when surface mount components are assembled to the board:

Accepted Answer

A) insertion holes 
B) tooling holes 
C) via holes 
A) insertion holes 
B) tooling holes 
C) via holes

Question 12

Hand soldering is sometimes used after wave soldering in the solder paste and reflow soldering method to add delicate components that would be damaged in the harsh environment of the wave-soldering chamber:

Accepted Answer

A) True 
 B)False

Question 13

In the subtractive circuitization method used to transform a copper-clad board into a printed circuit board, portions of the copper cladding that are coated with resist are etched away so that the tracks and lands of the desired circuit remain:

Accepted Answer

A) True 
 B)False

Question 14

In the solder paste and reflow soldering method of affixing components in surface-mount technology, the methods of applying the solder paste to the surface of the printed circuit board include which of the following (two best answers):

Accepted Answer

A) automated placement machines 
B) hand painting 
C) photolithography 
D) screen printing 
E) semiautomatic placement machines
F)syringe dispensing 
A) automated placement machines 
B) hand painting 
C) photolithography 
D) screen printing 
E) semiautomatic placement machines
F)syringe dispensing

Question 15

Surface-mount technology is used at which one of the following packaging levels:

Accepted Answer

A) zero 
B) first 
C) second 
D) third 
E) fourth 
A) zero 
B) first 
C) second 
D) third 
E) fourth

Question 16

The first level of packaging refers to which one of the following:

Accepted Answer

A) Chip-to-package interconnections to form an IC package 
B) circuit board to rack 
C) IC package to printed circuit board 
D) intraconnections on the IC chip 
E) wiring and cabling connections in the cabinet 
A) Chip-to-package interconnections to form an IC package 
B) circuit board to rack 
C) IC package to printed circuit board 
D) intraconnections on the IC chip 
E) wiring and cabling connections in the cabinet

Exam 31: Electronics Assembly and Packaging

In general, which of the following technologies causes more problems during rework:

In addition to copper, which one of the following is another common metal plated onto a PCB:

Typical thickness of the copper layer in a printed circuit board is which one of the following:

In the adhesive bonding and wave soldering method of affixing components in surface-mount technology, the components themselves pass through the molten solder wave:

The solder paste and reflow soldering method of affixing components in surface-mount technology includes a wave soldering step to securely attach the components to the board:

Card-on-board (COB) packaging refers to which one of the following packaging levels:

Which of the following electrical connection methods produce a separable connection (two correct answers):

Which of the following polymeric materials is commonly used as an ingredient in the insulation layer of a printed circuit board (two correct answers):

Which of the following plating processes has the higher deposition rate in PCB fabrication:

Which of the following are the soldering processes used to attach components to printed circuit boards in through-hole technology (two best answers):

Several types of holes must be created in a printed circuit board prior to assembly.Which one of the following hole types is not required when surface mount components are assembled to the board:

Hand soldering is sometimes used after wave soldering in the solder paste and reflow soldering method to add delicate components that would be damaged in the harsh environment of the wave-soldering chamber:

In the subtractive circuitization method used to transform a copper-clad board into a printed circuit board, portions of the copper cladding that are coated with resist are etched away so that the tracks and lands of the desired circuit remain:

In the solder paste and reflow soldering method of affixing components in surface-mount technology, the methods of applying the solder paste to the surface of the printed circuit board include which of the following (two best answers):

Surface-mount technology is used at which one of the following packaging levels:

The first level of packaging refers to which one of the following:

Introduction and Overview of Manufacturing

The Nature of Materials

Mechanical Properties of Materials

Physical Properties of Materials

Engineering Materials

Dimensions, Surfaces, and Their Measurement

Fundamentals of Metal Casting

Metal Casting Processes

Glassworking

Shaping Processes for Plastics

Processing of Polymer Matrix Composites and Rubber

Powder Metallurgy

Processing of Ceramics and Cermets

Fundamentals of Metal Forming

Bulk Deformation Processes in Metal Workiing

Sheet Metalworking

Theory of Metal Machining

Machining Operations and Machine Tools

Cutting Tool Technology

Economic and Product Design Considerations

Grinding and Other Abrasive Processes

Nontraditional Machining and Thermal Cutting

Heat Treatment of Metals

Surface Processing Operations

Fundamentals of Welding

Welding Processes

Brazing, Soldering, and Adhesive Bonding

Mechanical Assembly

Rapid Prototyping and Additive Manufacturing

Processing of Integrated Circuits

Microfabrication Technologies

Nanofabrication Technologies

Automation Technologies for Manufacturing Systems

Integrated Manufacturing Systems

Process Planning and Production Control

Quality Control and Inspection

Filters